TECHNICAL VERTICALS
System-on-Chip
Compressing required components into a single chip
Moore’s law has driven an exponential increase in the number of devices that can fit onto a single chip, ushering in an era where most electronic systems contain chips that integrate various previously discrete components, such as microprocessors, DSPs, dedicated hardware processing engines, memories, and interfaces to I/O devices and off-chip storage.
Today, most electronic systems—cell phones, iPods, set-top boxes, digital TVs, automobiles—contain at least one System-on-Chip (SoC). Designing SoCs is a highly complex process. Before entering the traditional VLSI implementation stages (RTL, logic, and physical design), designers must tackle the challenging tasks of developing a functional specification, partitioning and mapping functions onto hardware components and software, creating a communication architecture to interconnect components, and performing functional, performance, and power analysis and validation.
SCALE participates in the Center for Secure Microelectronics Ecosystem (CSME), a partnership between industry, academia, and the U.S. government to advance the field of secure microelectronics. More information is available on the CSME website.
PARTNERS IN
System-on-Chip
OHIO STATE UNIVERSITY — TECH LEAD
PURDUE UNIVERSITY — TECH LEAD
GEORGIA TECH
UNIVERSITY OF CALIFORNIA — BERKELEY
MORGAN STATE UNIVERSITY
TECHNICAL LEADS
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Steve Bibyk
The Ohio State University
Research Focus
Trust and assurance of secure electronic systems, rapid prototyping of embedded systems, reincarnating art and technology pieces for education of innovation and inventing.
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Ayman Fayed
The Ohio State University
Research Focus
Dr. Fayed’s main area of expertise is in the field of analog, mixed-signal, and power management Integrated Circuits design. His current research interests include on-chip power supplies for dynamic energy distribution in System-on-Chip (SoCs) and multi-core CPUs, high-frequency switching regulators with on-chip and on-package passives, low-noise power supplies and power supply modulators for analog and RF circuits, energy-harvesting platforms for power-restricted & remotely-deployed systems, fully-integrated power converters in SiC and GaN technologies.
