TECHNICAL VERTICALS

Heterogeneous Integration/Advanced Packaging

Integrating different components to enhance functionality

The rapid increase in chip performance associated with Moore’s law has raised interest and expectations around creating packaging devices with improved size, weight, and power.

To keep sizes manageable while improving functionality, complex packaged electronics like iPhones require similar components to be compressed together horizontally and vertically, and combined with dissimilar components providing complementary functions.

Significant challenges in heterogeneous integration include maintaining reliability of connections such as solder bumps, managing thermal cycling, and limiting damage from mechanical stress that can cause failures.

PARTNERS IN

Heterogeneous Integration/Advanced Packaging

PURDUE UNIVERSITY — TECH LEAD

ARIZONA STATE UNIVERSITY

GEORGIA TECH

UNIVERSITY OF FLORIDA

UNIVERSITY OF TEXAS - EL PASO

SUNY — BINGHAMTON

TECHNICAL LEADS

Shubhra Bansal

Principal Investigator
Purdue University
Research Focus
- Renewable Energy Materials (physics-based energy yield predictions, sustainable PV and energy storage materials, recycling)
- Electro-Optical-Thermo-Mechanical Reliability (in-situ and in-operando accelerated stress tests)
- Heterogeneous Integration & Advanced Packaging (sub-10 μm pitch interconnects, low-loss interposers)
- Harsh Environment Electronics Integration (high temperature Pb-free solders and nano-thermal interfaces)
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Amy Marconnet

Student Experiences Lead
Purdue University
Research Focus
- Transport Phenomena in Multi-Scale, Heterogeneous Materials & Systems
- Fundamentals of Nanoscale Thermal Transport
- Heat Transfer in Natural and Synthetic Fiber Systems
- Thermofluids Interactions
- Multi-Physics Metrology Design
- Electronics Cooling and Thermal Management
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Ganesh Subbarayan

Technical Advisor
Purdue University
Research Focus
-Computational and experimental solid mechanics focused on fatigue, fracture, and multi-physics phase evolution problems
-Computational techniques including Finite Element Analysis (FEA), Isogeometric Analysis (IGA), geometric modeling, CAD and optimal design
-Heterogeneous Integration and Advanced Electronics Packaging with a focus on thermomechanical behavior, reliability, and electrical-thermal-mechanical co-design
Carol Handwerker

Technical Advisor
Purdue University
Research Focus
Developing innovative interconnect technologies for next-generation microelectronics and advanced packaging and sustainable materials for thin film solar cells, improving the reliability of Pb-free solder interconnects, particularly for high performance, military, and aerospace electronic systems, integrating sustainability in the design of new electronic materials, processes, and products, identifying and implementing strategies to move R&D into manufacturing and commercialization, using roadmapping, techno-economic analysis, and formation of self-assembling socio-ecological systems, and controlling interface properties to design microstructures in polycrystalline materials and thin films