SCALE Heterogeneous Integration & Advanced Packaging

The SCALE (Semiconductor and Integrated Circuit Engineering) program at Purdue University offers a comprehensive curriculum in heterogeneous integration and advanced packaging. The program is led by 18 faculty members from various departments, who work together to provide students with hands-on research experience and access to cutting-edge technologies. Students can participate in research projects with faculty members, collaborate with industry partners, and take advantage of resources at partner institutions such as Georgia Tech, Arizona State University, and SUNY Binghamton.
The program also offers a concentration or certification in SCALE Heterogeneous Integration & Advanced Packaging, which will be available starting Fall 2025. This concentration will consist of nine credit hours of stackable modules that can be taken online or in-person, providing students with a comprehensive understanding of the field. The program aims to equip students with the knowledge and skills needed to succeed in the rapidly evolving field of advanced packaging and heterogeneous integration. Through its research opportunities, industry partnerships, and educational resources, the SCALE program at Purdue University is poised to become a leader in this exciting and rapidly growing field.